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Particle Adhesion and Removal

Edited K.L. Mittal and Ravi Jaiswal
Series: Adhesion and Adhesives: Fundamental and Applied Aspects
Copyright: 2015   |   Status: Published
ISBN: 9781118831533  |  Hardcover  |  
558 pages
Price: $200.95 USD
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One Line Description
Provides a comprehensive and easily accessible reference source covering all important fundamental aspects of particle adhesion and removal

The book should be of interest to researchers in academia and R&D, manufacturing, and
quality control personnel in microelectronics, aerospace, automotive, optics, solar panels, pharmaceutical, biomedical, equipment cleaning and wafer reclaiming industries.

The importance of particle adhesion and removal is quite manifest in many areas of human endeavor (ranging from microelectronics to optics, and space to biomedical). In semiconductors with its ever-shrinking dimensions, particles which, just a few years ago, were cosmetically undesirable but functionally innocuous, are now “killer” defects. As device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, so if a particle is trapped in the gap this can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces are all too obvious.

Particulate contamination on surfaces is an obstacle to greater functionality, yield, and reliability. With the burgeoning interest in nanotechnologies, the need to remove nano and sub-nano particles will be more and more intense. It should be noted that in some situations particle adhesion is a requirement. For example, in photocopying the toner particles must adhere well to obtain quality photocopies.

Among the topics to be covered include:

• Fundamentals of surface forces in particle adhesion and removal
• Mechanisms of particle adhesion and removal
• Experimental methods (e.g. AFM, SFA, SFM, IFM, etc.) to understand/investigate particle-particle and particle-substrate interactions
• Mechanics of adhesion of micro- and nanoscale particles
• Various factors affecting particle adhesion to a variety of substrates
• Surface modification techniques to modulate particle adhesion
• Various cleaning methods (both wet & dry) for particle removal
• Relevance of particle adhesion in a host of technologies ranging from simple
to ultra-sophisticated

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Author / Editor Details
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 120 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives

Ravi Jaiswal is a chemical engineer and an active researcher in the field of surface and interfacial science. He has authored more than 10 original research publications in the field of particle adhesion and removal. He has delivered more than 10 technical talks in the national and international conferences covering topics relevant to particle adhesion. He is a regular reviewer of the research manuscripts published in the journal of IEEE Transactions on Semiconductor Manufacturing. He has been awarded ‘Leighton H. Peebles Award’ by The Adhesion Society in 2009 in the recognition to his outstanding graduate research contribution in the field of adhesion science and technology. Ravi completed his bachelor degree in chemical engineering from Indian Institute of Technology (IIT) Kanpur, India in 2004. He graduated with PhD in chemical engineering from Purdue University, W. Lafayette, IN, USA in 2008. He is currently employed at Sun Edison (formerly MEMC Electronic Materials), St. Peters, MO as a research scientist.

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Author/Editor Details
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