Browse Subject Areas

For Authors

Submit a Proposal

Join Our Mailing List

Enter your email address:

Enter your first name:

Enter your last name:

Choose subjects that interest you
Hold down the CTRL key for multiple selection

Particle Adhesion and Removal

Edited by K.L. Mittal and Ravi Jaiswal
Series: Adhesion and Adhesives: Fundamental and Applied Aspects
Copyright: 2015   |   Status: Published
ISBN: 9781118831533  |  Hardcover  |  
570 pages | 223 illustrations
Price: $195 USD
Add To Cart

One Line Description
Provides a comprehensive and easily accessible reference source covering all important fundamental and applied aspects of particle adhesion and removal

The book should be of interest to researchers in academia and R&D, manufacturing, and quality control personnel in microelectronics, aerospace, automotive, optics, solar panels, pharmaceutical, biomedical,equipment cleaning and wafer reclaiming industries.

The importance of particle adhesion and removal is quite manifest in many areas of human endeavor (ranging from microelectronics to optics, and space to biomedical). In semiconductors with ever-shrinking dimensions, particles which, just a few years ago, were cosmetically undesirable but functionally innocuous, are now “killer” defects. As device sizes get smaller, there will be more and more concern about smaller and smaller particles. In the information storage technology, the gap between the head and the disk is very narrow, so if a particle is trapped in the gap this can have very grave consequences. The implications of particulate contamination on sensitive optical surfaces are all too obvious.
Particulate contamination on surfaces is an obstacle to higher functionality, yield, and reliability. With the burgeoning interest in nanotechnologies, the need to remove nano and sub-nano particles will be more and more intense. It should be noted that in some situations particle adhesion is a requirement. For example, in photocopying the toner particles must adhere well to obtain quality photocopies.
Among the topics covered are:
• Fundamentals of surface forces in particle adhesion and removal
• Mechanisms of particle adhesion and removal
• Experimental methods (e.g. AFM, SFA, SFM, IFM, etc.) to understand/investigate particle-particle and particle-substrate interactions
• Mechanics of adhesion of micro- and nanoscale particles
• Various factors affecting particle adhesion to a variety of substrates
• Surface modification techniques to modulate particle adhesion
• Various cleaning methods (both wet & dry) for particle removal
• Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated

Back to Top
Author / Editor Details
Kashmiri Lal Mittal was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of 118 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives

Ravi Jaiswal is a chemical engineer and an active researcher in the field of surface and interfacial science. He has authored more than 10 original research publications in the field of particle adhesion and removal. He has delivered more than 10 technical talks in the national and international conferences covering topics relevant to particle adhesion. He is the recipient of the ‘Leighton H. Peebles Award’ by The Adhesion Society in 2009 in the recognition of his outstanding graduate research contribution in the field of adhesion science and technology. Ravi completed his bachelor degree in chemical engineering from the Indian Institute of Technology (IIT) Kanpur, India in 2004. He received his PhD in chemical engineering from Purdue University, W. Lafayette, IN,USA in 2008.

Back to Top

Table of Contents
Part 1: Particle Adhesion: Fundamentals
1 Fundamental Forces in Particle Adhesion

Stephen Beaudoin, Priyanka Jaiswal, Aaron Harrison, Jennifer Laster, Kathryn Smith, Melissa Sweat, and Myles Thomas
2 Mechanics of Particle Adhesion and Removal
Goodarz Ahmadi
3 Microscopic Particle Contact Adhesion Models and Macroscopic Behavior of Surface Modified Particles
Katja Mader-Arndt, Zinaida Kutelova and Jürgen Tomas
4 Characterization of Single Particle Adhesion: A Review of Recent Progress
Armin Saeedi Vahdat and Cetin Cetinkaya
Part 2: Particle Removal Techniques
5 High Intensity Ultrasonic Cleaning for Particle Removal

Sami B. Awad and Nadia F. Awad
6 Megasonic Cleaning for Particle Removal
Manish Keswani, Rajesh Balachandran, and Pierre Deymier
7 High Speed Air Jet Removal of Particles from Solid Surfaces
Kuniaki Gotoh
8 Droplet Spray Technique for Particle Removal
James T. Snow, Masanobu Sato and Takayoshi Tanaka
9. Laser-Induced High-Pressure Micro-Spray Process for Nanoscale Particle Removal
Daehwan Ahn, Changho Seo and Dongsik Kim
10 Wiper-Based Cleaning of Particles from Surfaces
Brad Lyon and Jay Postlewaite
11 Application of Strippable Coatings for Removal of Particulate Contaminants
Rajiv Kohli
12 Cryoaerosol Cleaning of Particles from Surfaces
Souvik Banerjee
13 Supercritical Carbon Dioxide Cleaning: Relevance to Particle Removal
Rajiv Kohli
14 The Use of Surfactants to Enhance Particle Removal from Surfaces
Brian Grady

Back to Top

Author/Editor Details
Table of Contents
Bookmark this page