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Adhesion in Microelectronics

Edited by K.L. Mittal and Tanweer Ahsan
Series: Adhesion and Adhesives: Fundamental and Applied Aspects
Copyright: 2014   |   Status: Published
ISBN: 9781118831335  |  Hardcover  |  
364 pages | 144 illustrations
Price: $195 USD
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One Line Description
Provides a comprehensive review with emphasis on recent developments in the area of adhesion relevant to the microelectronics industry

Audience
The book is of critical importance to materials scientists and electronics engineers involved or interested in understanding and achieving the required level of adhesion in the overall microelectronics industry, as well as R & D and manufacturing personnel in other industries, e.g, packaging, thin film technology, metallized plastics, encapsulation, printed circuit boards, etc

Description
The phenomenon of adhesion is of cardinal importance in the domain of microelectronics. For example, adequate adhesion of thin films is sine qua non in integrated circuits; adhesion of polymeric and other materials is a must in devices; and adhesion of various materials is crucial in fabricating printed circuit boards. Although there has been a high tempo of R & D activity in the field, the information is scattered in a number of publication media. Up until to now, there has been no single easily accessible source where one can find the requisite information. The rationale for compiling this comprehensive book on Adhesion in Microelectronics, therefore, is to provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Our intent in this book is to cover the various aspects of adhesion as they pertain to the field of microelectronics. The book contains 8 large chapters by leading experts in the field and is divided into three parts: Part 1: Adhesion: Fundamentals and Measurement; Part 2: Ways to Promote/Enhance Adhesion; and Part 3: Reliability and Failure Mechanisms.
Among the topics covered are:
• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces/interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films, underfills, molding compounds, and different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings

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Author / Editor Details
KASHMIRI LAL MITTAL, was employed by the IBM Corporation from 1972 through 1993. Currently, he is teaching and consulting worldwide in the broad areas of adhesion as well as surface cleaning. He has received numerous awards and honors including the title of doctor honoris causa from Maria Curie-Skłodowska University, Lublin, Poland. He is the editor of more than 115 books dealing with adhesion measurement, adhesion of polymeric coatings, polymer surfaces, adhesive joints, adhesion promoters, thin films, polyimides, surface modification, surface cleaning, and surfactants. Dr. Mittal is also the Founding Editor of the journal Reviews of Adhesion and Adhesives.

TANWEER AHSAN, is a materials and adhesion scientist at Henkel’s Electronic Materials Research and Development facility located in Irvine, California. He holds a bachelor’s degree with honors in applied chemistry and a PhD in surface/physical chemistry, both from Brunel, The University of West London, UK. As a materials scientist, his interests are polymer-mineral interfacial chemistry, nano-composites, catalysts and catalytic processes, surface energetics and adhesion of polymer & plastics with inorganic and metal surfaces. He has numerous publications, presentations and US patents in electronic materials, catalysis and adhesion related areas.

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Table of Contents
Preface
Acknowledgements
Part 1: Adhesion: Fundamentals and Measurement
1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics

Robert R. Mallik
2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics.
Wei-Sheng Lei and Ajay Kumar
Part 2: Ways to Promote/Enhance Adhesion
3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion

Jörg Friedrich
4 Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging
Hang Yu, Yiyuan Zhang, Anita Wong, Igor M. De Rosa, Han S. Chueh, Misha Grigoriev, Thomas S. Williams, Tommy Hsu, and Robert F. Hicks
5 Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
James E. Morris and Liang Wang
Part 3: Reliability and Failure Mechanisms
6 Role of Adhesion Phenomenon in the Reliability of Electronic Packaging

Puligandla Viswanadham
7 Delamination and Reliability Issues in Packaged Devices
Wei-Sheng Lei and Ajay Kumar
8 Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages
Tanweer Ahsan and Andrew Schoenberg
Index


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